出版地址：ASME-AMER SOC MECHANICAL ENG, THREE PARK AVE, NEW YORK, USA, NY, 10016-5990
期刊简介：Journal of Electronic Packaging《电子封装杂志》（季刊）. The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
